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CLVCC3245AIDBREP - Texas Instruments

Description: Enhanced Product Octal Bus Transceiver With Adjustable Output Voltage And 3-State Outputs

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CLVCC3245AIDBREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DB (R-PDSO-G24)
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CLVCC3245AIDBREP - Texas Instruments  - 3D model - Small Outline Packages - DB (R-PDSO-G24)
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CLVCC3245AIDBREP Details

  • Manufacturer Part Number:

    CLVCC3245AIDBREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    24

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    2.3V TO 3.6V SUPPLY FOR PORT A; 3V TO 5.5V SUPPLY FOR PORT B

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    8.2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP24,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.13 mA

  • Prop. Delay@Nom-Sup:

    7.6 ns

  • Propagation Delay (tpd):

    7.6 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

CLVCC3245AIDBREP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the power and ground planes separate, using a solid ground plane, and minimizing signal trace lengths and widths.
  • The CLVCC3245AIDBREP has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow.
  • While the CLVCC3245AIDBREP has built-in ESD protection, it's not foolproof. Follow proper ESD handling procedures, and consider adding external ESD protection devices if your application requires it. Be aware that the device's ESD protection may not cover all possible ESD scenarios.
  • To ensure signal integrity, use controlled impedance traces, minimize signal trace lengths, and avoid signal reflections. Use termination resistors if necessary, and consider using a signal integrity analysis tool to simulate and optimize your design.
  • The CLVCC3245AIDBREP requires a specific power sequencing to prevent damage. Ensure that the power supplies are turned on in the correct order, and that the voltage rails are stable before enabling the device. Refer to the datasheet for specific power sequencing requirements.

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CLVCC3245AIDBREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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