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CLVTH162245IDGGREP - Texas Instruments

Description: Enhanced Product 3.3-V Abt 16-Bit Bus Transceivers With 3-State Outputs

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CLVTH162245IDGGREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0048A
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CLVTH162245IDGGREP - Texas Instruments  - 3D model - Small Outline Packages - DGG0048A
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CLVTH162245IDGGREP Details

  • Manufacturer Part Number:

    CLVTH162245IDGGREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    LVT

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.064 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    16

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE WITH SERIES RESISTOR

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.005 mA

  • Prop. Delay@Nom-Sup:

    4 ns

  • Propagation Delay (tpd):

    4.6 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

CLVTH162245IDGGREP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias near the device. Additionally, consider using a 4-layer PCB with a dedicated power plane and a separate ground plane.
  • To minimize EMI, use differential signaling, keep signal traces short and away from edges, and use a common-mode choke or ferrite bead to filter out high-frequency noise. Also, consider using a shielded enclosure and ensuring good grounding practices.
  • The CLVTH162245IDGGREP is rated for operation from -40°C to 85°C. However, it's essential to consider the thermal design and ensure proper heat dissipation to maintain reliable operation within this range.
  • To ensure signal integrity and minimize jitter, use a high-quality clock source, maintain a stable power supply, and use a low-jitter PLL or clock buffer. Additionally, consider using a signal integrity analysis tool to simulate and optimize your design.
  • The CLVTH162245IDGGREP requires a specific power sequencing to ensure proper operation. The recommended power-up sequence is VCC, then VCCA, and finally VCCIO. The power-down sequence should be reversed. Refer to the datasheet for more detailed information.

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CLVTH162245IDGGREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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