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CLVTH16245AQDGGREP - Texas Instruments

Description: Enhanced Product 3.3-V Abt 16-Bit Bus Transceivers With 3-State Outputs

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CLVTH16245AQDGGREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0048A
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CLVTH16245AQDGGREP - Texas Instruments  - 3D model - Small Outline Packages - DGG0048A
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CLVTH16245AQDGGREP Details

  • Manufacturer Part Number:

    CLVTH16245AQDGGREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    LVT

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    16

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    5 mA

  • Prop. Delay@Nom-Sup:

    4.5 ns

  • Propagation Delay (tpd):

    4.6 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

CLVTH16245AQDGGREP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed design practices, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines to ensure signal integrity.
  • The CLVTH16245AQDGGREP has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Follow the recommended thermal design guidelines in the datasheet.
  • The CLVTH16245AQDGGREP is specified to operate up to 2.5 Gbps, but the actual maximum frequency may vary depending on the system design, PCB layout, and signal quality. It's recommended to perform signal integrity analysis and testing to determine the maximum operating frequency for your specific application.
  • To minimize jitter and ensure signal integrity, use a well-designed PCB with controlled impedance, minimize signal reflections, and use signal termination resistors as recommended in the datasheet. Additionally, consider using a signal integrity analysis tool to simulate and optimize your design.
  • Decoupling capacitors should be placed as close as possible to the device's power pins. Use a combination of ceramic and electrolytic capacitors to filter out high-frequency noise and ensure a stable power supply. Follow the recommended decoupling guidelines in the datasheet.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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