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CM1214A-02MR - onsemi

Description: Single channel ESD protection for an AC signal up to ±5 V for 0.25 W transmit power; Connects two channels in series for signals up to 10 V (1 W transmit power)

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CM1214A-02MR - onsemi - PCB symbol
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PCB Footprints
CM1214A-02MR - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MICRO8 CASE 846A-02 ISSUE H
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CM1214A-02MR - onsemi - 3D model - Small Outline Packages - MICRO8 CASE 846A-02 ISSUE H
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CM1214A-02MR Details

  • Manufacturer Part Number:

    CM1214A-02MR

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    Micro 8 lead Surface Mount

  • Package Description:

    MSOP-10

  • Pin Count:

    8

  • Manufacturer Package Code:

    846A-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Clamping Voltage-Max:

    11.3 V

  • Configuration:

    SEPARATE, 2 ELEMENTS, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    MO-187AA

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.4 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    7 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

CM1214A-02MR Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended. Refer to the onsemi application note AND9173/D for more details.
  • Ensure that the device is operated within the recommended voltage and current ratings. Use a suitable heat sink and thermal interface material to maintain a junction temperature below 150°C. Follow the recommended PCB layout and thermal design guidelines.
  • The CM1214A-02MR has built-in ESD protection diodes on all pins. However, it is still recommended to follow proper ESD handling and storage procedures. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ratings, and avoid voltage spikes or transients on the power supply lines.
  • Yes, the CM1214A-02MR is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q100 and is manufactured using a qualified process. However, additional testing and validation may be required for specific applications.
  • Follow the onsemi recommended soldering and rework guidelines, which include a peak temperature of 260°C, a soldering time of 10 seconds, and a maximum of 3 rework cycles. Refer to the onsemi application note AND9174/D for more details.

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CM1214A-02MR Overview

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