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CM1231-02SO - onsemi

Description: Two stage matched clamp architecture; Exceeds ESD protection to IEC61000-4-2 Level 4; Flow-through routing for high-speed signal integrity

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CM1231-02SO - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - CM1231-02SO
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CM1231-02SO - onsemi  - 3D model - SOT23 (6-Pin) - CM1231-02SO
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CM1231-02SO Details

  • Manufacturer Part Number:

    CM1231-02SO

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23, 6 Lead, 1.6x2.9

  • Package Description:

    SOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    527AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Clamping Voltage-Max:

    9 V

  • Configuration:

    COMPLEX, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    MO-178AB

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    2 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

CM1231-02SO Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Exceeding the maximum junction temperature (Tj) can lead to reduced lifespan, decreased performance, and potential device failure. Ensure the system design keeps the junction temperature below the recommended maximum of 150°C.
  • Yes, the CM1231-02SO is suitable for high-reliability and automotive applications. However, ensure compliance with relevant industry standards (e.g., AEC-Q100) and perform thorough testing and validation.
  • Implement ESD protection measures during handling, storage, and assembly. Use ESD-safe materials, follow proper handling procedures, and consider adding external ESD protection devices if necessary.

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CM1231-02SO Overview

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Part Image CM1231-02SO California Micro Devices

Trans Voltage Suppressor Diode, Bidirectional, 4 Element, Silicon, MO-178AB