A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
Ensure proper thermal management, use a heat sink if necessary, and follow the recommended PCB layout. Also, consider the device's power dissipation and thermal resistance (RθJA) when designing the system.
The CM1624-08DE has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and use ESD-protective packaging. For latch-up prevention, ensure proper power sequencing and decoupling.
Yes, the CM1624-08DE is AEC-Q100 qualified and suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions, and consult with onsemi for specific requirements and testing.
Follow the onsemi recommended soldering profile, and ensure a peak reflow temperature of 260°C (500°F). Use a no-clean or water-soluble flux, and avoid excessive soldering temperatures or times.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
CM1624-08DE Overview
Use the download button to access the CM1624-08DE 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like CM162,
or try a keyword search, such as Data Line Filters
Suggested Parts
If you searched for CM1624-08DE, you might also be interested in these parts:
