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CMD263P3 - Qorvo

Description: 5-11 GHz (C, X Band) Low Noise Amplifier MMIC

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PCB Footprints
CMD263P3 - Qorvo PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN-16-3
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3D Models
CMD263P3 - Qorvo  - 3D model - Quad Flat No-Lead - QFN-16-3
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CMD263P3 Details

  • Manufacturer Part Number:

    CMD263P3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-16

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Qorvo

  • YTEOL:

    7.27

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    19 dB

  • Input Power-Max (CW):

    20 dBm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Frequency-Max:

    11000 MHz

  • Operating Frequency-Min:

    5000 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Power Supplies:

    3.6 V

  • RF/Microwave Device Type:

    WIDE BAND LOW POWER

  • Supply Current-Max:

    42 mA

  • Surface Mount:

    YES

CMD263P3 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize the distance to the antenna. A 50-ohm microstrip line should be used to connect the device to the antenna.
  • The optimal bias point for maximum power efficiency is typically around 3.5V to 4.5V. The bias current should be set to around 200-300 mA. The device should be operated in a Class-AB mode to achieve the best trade-off between power efficiency and linearity.
  • A simple L-match or pi-match network can be used to match the device to a 50-ohm load. The values of the matching components will depend on the specific application and frequency of operation. A simulation tool such as ADS or AWR can be used to optimize the matching network.
  • The device should be mounted on a heat sink or a thermal pad to dissipate heat. The heat sink should be designed to provide good thermal conductivity and should be attached to the device using a thermal interface material. The device should be operated at a temperature below 85°C to ensure reliable operation.
  • The recommended input impedance is 50 ohms, and the recommended output impedance is also 50 ohms. The device is designed to operate with a 50-ohm input and output impedance to ensure maximum power transfer and minimum reflections.

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CMD263P3 Overview

Use the download button to access the CMD263P3 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CMD26, or try a keyword search, such as RF/Microwave Amplifiers

About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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