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CMD315C4 - Qorvo

Description: RF Amplifier IC General Purpose 4GHz ~ 10GHz 24-SMT (3.9x3.9)

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PCB Footprints
CMD315C4 - Qorvo PCB footprint - Other - Other - CMD315C4-1
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3D Models
CMD315C4 - Qorvo  - 3D model - Other - CMD315C4-1
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CMD315C4 Details

  • Manufacturer Part Number:

    CMD315C4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Qorvo

  • YTEOL:

    7.31

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    16.5 dB

  • Input Power-Max (CW):

    20 dBm

  • JESD-609 Code:

    e4

  • Operating Frequency-Max:

    10000 MHz

  • Operating Frequency-Min:

    4000 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • RF/Microwave Device Type:

    WIDE BAND MEDIUM POWER

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

CMD315C4 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize the distance to the antenna. A 50-ohm microstrip transmission line should be used to connect the device to the antenna.
  • The optimal bias point for maximum power efficiency is typically around 3.5V to 4.5V. The bias voltage should be adjusted to achieve the desired output power while minimizing current consumption. A bias tee or a separate bias voltage regulator can be used to optimize the biasing.
  • A pi-network or a T-network can be used for input and output matching. The network should be designed to match the device's input and output impedance to 50 ohms. The values of the matching components can be determined using simulation software or by iterative measurement and optimization.
  • The device's voltage, current, and temperature should be monitored to ensure they are within the specified limits. The device's power dissipation should be calculated and compared to the maximum allowed value. A thermal management system, such as a heat sink or thermal pad, should be used to keep the device temperature within the specified range.
  • A diode-based ESD protection circuit or a transient voltage suppressor (TVS) can be used to protect the device from electrostatic discharge. The protection circuit should be designed to clamp the voltage to a safe level and to provide a low impedance path to ground.

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CMD315C4 Overview

Use the download button to access the CMD315C4 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CMD31, or try a keyword search, such as RF/Microwave Amplifiers

About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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