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CMD317C4 - Qorvo

Description: 1-24 GHz Distributed Driver Amplifier

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PCB Footprints
CMD317C4 - Qorvo PCB footprint - Other - Other - Ceramic QFN 4x4 mm x 24 leads
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3D Models
CMD317C4 - Qorvo  - 3D model - Other - Ceramic QFN 4x4 mm x 24 leads
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CMD317C4 Details

  • Manufacturer Part Number:

    CMD317C4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Qorvo

  • YTEOL:

    7.17

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    9.5 dB

  • Input Power-Max (CW):

    20 dBm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Frequency-Max:

    24000 MHz

  • Operating Frequency-Min:

    1000 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    METAL

  • Package Equivalence Code:

    LCC24,.15SQ,20

  • Power Supplies:

    8 V

  • RF/Microwave Device Type:

    WIDE BAND LOW POWER

  • Supply Current-Max:

    280 mA

  • Surface Mount:

    YES

  • Technology:

    GAAS

  • VSWR-Max:

    1.58

CMD317C4 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize the distance to the antenna. A 50-ohm microstrip line should be used to connect the device to the antenna.
  • The optimal bias point for maximum power efficiency is typically around 3.5V to 4.5V. The bias voltage should be adjusted to achieve the desired output power while minimizing current consumption. A bias tee or a separate bias voltage supply can be used to optimize the biasing.
  • A pi-network or a T-network can be used for input and output matching. The network should be designed to match the device's input and output impedance to 50 ohms. The values of the matching components can be determined using simulation software or empirical methods.
  • To ensure stability, the device should be operated within the recommended operating conditions. A decoupling capacitor should be placed close to the device to filter out noise and ripple. The PCB layout should be designed to minimize parasitic inductance and capacitance.
  • The maximum operating temperature of the CMD317C4 is 125°C. The device should be operated within the recommended temperature range to ensure reliable operation and to prevent thermal runaway.

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CMD317C4 Overview

Use the download button to access the CMD317C4 schematic symbol, PCB footprint, and 3D model.
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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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