The recommended land pattern for the CMP0805-FX-10R0ELF is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
The CMP0805-FX-10R0ELF has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The recommended soldering profile for the CMP0805-FX-10R0ELF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C.
Yes, the CMP0805-FX-10R0ELF is compatible with lead-free soldering. It is RoHS compliant and can be soldered using lead-free soldering processes.
The CMP0805-FX-10R0ELF has a moisture sensitivity level (MSL) of 3, which means it can withstand exposure to moisture for up to 168 hours without damage.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
CMP0805-FX-10R0ELF Overview
Use the download button to access the CMP0805-FX-10R0ELF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CMP08,
or try a keyword search, such as Metal Glaze/Thick Film Resistors
