The recommended land pattern for CMP1206QFX-43R0ELF is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While the CMP1206QFX-43R0ELF is rated for operation up to 125°C, it's recommended to derate the component's power rating at higher temperatures. Consult the datasheet and Bourns' application notes for more information on high-temperature operation.
To prevent ESD damage, handle the CMP1206QFX-43R0ELF with ESD-safe materials, such as wrist straps, mats, and bags. Ensure that the component is stored in a dry, ESD-controlled environment, and avoid touching the component's pins or body.
The recommended soldering profile for CMP1206QFX-43R0ELF is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure that the soldering process is done in a nitrogen atmosphere to prevent oxidation.
While the CMP1206QFX-43R0ELF is rated for operation in a humid environment, it's recommended to take precautions to prevent moisture ingress. Apply a conformal coating or potting compound to protect the component from moisture, and ensure that the component is properly sealed in its enclosure.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
CMP1206QFX-43R0ELF Overview
Use the download button to access the CMP1206QFX-43R0ELF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CMP12,
or try a keyword search, such as Metal Glaze/Thick Film Resistors
