MACOM recommends a 4-layer PCB with a solid ground plane on the bottom layer, a power plane on the internal layer, and signal traces on the top and internal layers. A via-stitching pattern is also recommended to connect the ground plane to the heat sink.
The CMPA601J025F has a high power density, so thermal management is critical. MACOM recommends using a heat sink with a thermal resistance of <1°C/W, and applying a thermal interface material (TIM) with a thermal conductivity of >1 W/m-K. The device should be mounted on a metal plate or heat sink with a thermal conductivity of >100 W/m-K.
The maximum operating temperature for the CMPA601J025F is 150°C, but MACOM recommends operating the device at a temperature of <125°C for optimal reliability and performance.
The CMPA601J025F requires a bias voltage of 28V and a quiescent current of 150mA for optimal performance. The bias voltage should be applied through a resistor network to ensure stable operation.
The CMPA601J025F has a typical output power of 60W and a gain of 25dB at 2GHz. However, the actual output power and gain may vary depending on the operating frequency, bias conditions, and load impedance.
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CMPA601J025F Overview
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