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CMX969D5 - CML Micro

Description: Telecom Interface ICs Signalling Processor with Medium Access Control (MAC) for DAC, Dual Mode RD-LAP and Motient/ARDIS

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CMX969D5 - CML Micro PCB footprint - Small Outline Packages - Small Outline Packages - CMX264D5__
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CMX969D5 - CML Micro  - 3D model - Small Outline Packages - CMX264D5__
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CMX969D5 Details

  • Manufacturer Part Number:

    CMX969D5

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    SSOP-24

  • Pin Count:

    24

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    CML Microcircuits Plc

  • Data Rate:

    19 Mbps

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    8.2 mm

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP24,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    0.009 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Telecom IC Type:

    MODEM-SUPPORT CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5.3 mm

CMX969D5 Frequently Asked Questions (FAQs)

  • CML Microcircuits provides a recommended PCB layout and thermal management guide in their application note AN019, which can be found on their website. It's essential to follow these guidelines to ensure optimal performance, thermal stability, and to prevent overheating.
  • The CMX969D5 has various power-saving modes and configuration options. Refer to the device's programming guide and application notes for specific guidance on configuring the device for optimal power consumption. Additionally, consider using the device's built-in power management features, such as the power-down mode and clock gating.
  • CML Microcircuits recommends using high-quality test and measurement equipment, such as signal generators, spectrum analyzers, and oscilloscopes, to characterize the device's performance. Specifically, they suggest using equipment with high dynamic range, low noise floor, and high-frequency capabilities to accurately measure the device's performance.
  • To ensure EMC and EMI compliance, follow the guidelines outlined in the device's datasheet and application notes. Implement proper PCB layout, grounding, and shielding techniques. Additionally, consider using EMI filters, chokes, and other noise-reducing components to minimize emissions and susceptibility.
  • CML Microcircuits performs various reliability and environmental tests on the CMX969D5, including temperature cycling, humidity testing, and vibration testing. Refer to the device's reliability report and environmental testing documentation for specific details on the testing procedures and results.

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CMX969D5 Overview

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