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CP3CN37VVAWQX/NOPB - Texas Instruments

Description: 16-bit Microcontrollers - MCU CONN PROC CNTRLR IC

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CP3CN37VVAWQX/NOPB - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PGE (S-PQFP-G144)
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CP3CN37VVAWQX/NOPB - Texas Instruments  - 3D model - Quad Flat Packages - PGE (S-PQFP-G144)
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CP3CN37VVAWQX/NOPB Details

  • Manufacturer Part Number:

    CP3CN37VVAWQX/NOPB

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LQFP-144

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Date Of Intro:

    2018-05-17

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Address Bus Width:

    20

  • Boundary Scan:

    YES

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Speed:

    96 MHz

  • Supply Voltage-Max:

    3.7 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

CP3CN37VVAWQX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques, such as heat sinks or fans, to keep the device within the recommended temperature range.
  • The 'NOPB' suffix indicates that the device is lead-free and RoHS-compliant, meaning it does not contain lead (Pb) or other hazardous substances. This is important for environmental and regulatory compliance.
  • While the CP3CN37VVAWQX/NOPB is a high-performance device, it may not meet the specific requirements for high-reliability or aerospace applications. Texas Instruments offers other devices with enhanced screening and qualification for these types of applications.
  • Texas Instruments recommends following proper ESD handling and storage procedures to prevent damage. Additionally, consider using ESD protection devices, such as TVS diodes or ESD arrays, to protect the device from electrostatic discharge.

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CP3CN37VVAWQX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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