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CPDQR5V0HE-HF - Comchip Technology

Description: ESD Suppressors / TVS Diodes ESD 5V Bi-Direction

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CPDQR5V0HE-HF - Comchip Technology PCB footprint - Other - Other - CPDQR5V0HE-HF-2
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CPDQR5V0HE-HF Details

  • Manufacturer Part Number:

    CPDQR5V0HE-HF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    SOD-923F, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    4

  • Breakdown Voltage-Min:

    5.5 V

  • Breakdown Voltage-Nom:

    7 V

  • Clamping Voltage-Max:

    16 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Non-rep Peak Rev Power Dis-Max:

    128 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

CPDQR5V0HE-HF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Use a thermal interface material (TIM) between the device and heat sink, and ensure the heat sink is properly attached. Also, follow the recommended derating guidelines for temperature and voltage.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure proper cooling and thermal management to stay within the recommended temperature range.
  • Yes, but ensure the thermal interface material is compatible with the device and heat sink. Consult the heat sink manufacturer's recommendations and follow proper application procedures.
  • Follow standard ESD precautions, such as using an ESD wrist strap, mat, or workstation. Ensure all personnel handling the device are properly grounded, and use ESD-protective packaging and storage materials.

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