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CPF0402B162KE1 - TE Connectivity

Description: TE Connectivity CPF Series Precision Thin Film Surface Mount Fixed Resistor 0402 Case 162kΩ ±0.1% 0.063W ±25ppm/°C

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CPF0402B162KE1 - TE Connectivity - PCB symbol
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CPF0402B162KE1 - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CPF0402
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CPF0402B162KE1 - TE Connectivity - 3D model - Resistor Chip - CPF0402
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CPF0402B162KE1 Details

  • Manufacturer Part Number:

    CPF0402B162KE1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    UK

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    15

  • Additional Feature:

    PRECISION

  • Construction:

    RECTANGULAR PACKAGE

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Physical Dimension:

    1mm x .5mm x .3mm

  • Rated Power Dissipation (P):

    0.063 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    162000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    50 V

CPF0402B162KE1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CPF0402B162KE1 is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.1mm from the component body.
  • Yes, CPF0402B162KE1 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the maximum ratings specified in the datasheet.
  • To prevent damage, handle CPF0402B162KE1 by the edges or the body, avoiding touching the terminations. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • The recommended soldering profile for CPF0402B162KE1 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • CPF0402B162KE1 is not designed for use in humid or corrosive environments. If exposure to moisture or corrosive substances is unavoidable, consider using a conformal coating or potting compound to protect the component. However, this may affect the component's performance and reliability.

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CPF0402B162KE1 Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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