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CPF0603B221RE1 - TE Connectivity

Description: Thin Film Resistor 0603 221R 0.1% 25PPM Thin Film Resistor 0603 221R 0.1% 25PPM

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CPF0603B221RE1 - TE Connectivity - PCB symbol
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CPF0603B221RE1 - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CPF0603
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CPF0603B221RE1 - TE Connectivity - 3D model - Resistor Chip - CPF0603
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CPF0603B221RE1 Details

  • Manufacturer Part Number:

    CPF0603B221RE1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    14

  • Additional Feature:

    PRECISION

  • Construction:

    RECTANGULAR PACKAGE

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.55 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Physical Dimension:

    1.55mm x .8mm x .45mm

  • Rated Power Dissipation (P):

    0.063 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    221 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    50 V

CPF0603B221RE1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CPF0603B221RE1 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • CPF0603B221RE1 is rated for operation up to 150°C, but it's recommended to derate the component's power rating by 1.25% per degree Celsius above 125°C. For high-temperature applications, it's recommended to consult with TE Connectivity's application engineers for specific guidance.
  • To prevent damage, handle CPF0603B221RE1 by the edges or the body, avoiding touching the terminations. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • The recommended soldering profile for CPF0603B221RE1 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • CPF0603B221RE1 is not hermetically sealed and is not designed for use in humid or wet environments. If the component is exposed to moisture, it may lead to corrosion or electrical failure. For applications in humid or wet environments, consider using a hermetically sealed component or applying a conformal coating.

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CPF0603B221RE1 Overview

Use the download button to access the CPF0603B221RE1 schematic symbol, PCB footprint, and 3D model.
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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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