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CPF0805B1K15E1 - TE Connectivity

Description: TE Connectivity CPF Series Precision Thin Film Surface Mount Fixed Resistor 0805 Case 1.15kΩ ±0.1% 0.1W ±25ppm/°C

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CPF0805B1K15E1 - TE Connectivity - PCB symbol
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CPF0805B1K15E1 - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CPF0805
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CPF0805B1K15E1 - TE Connectivity - 3D model - Resistor Chip - CPF0805
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CPF0805B1K15E1 Details

  • Manufacturer Part Number:

    CPF0805B1K15E1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    14

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR

  • Physical Dimension:

    2mm x 1.25mm x .5mm

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    1150 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    100 V

CPF0805B1K15E1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CPF0805B1K15E1 is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper solder joint formation and to prevent solder bridging.
  • While CPF0805B1K15E1 is rated for operation up to 150°C, it's not recommended for use in high-temperature applications above 125°C without proper derating. Consult TE Connectivity's application notes for guidance on derating and thermal management.
  • Handle CPF0805B1K15E1 by the edges or the body, avoiding touching the terminations or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • The recommended soldering profile for CPF0805B1K15E1 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the specified temperature range to prevent damage to the component.
  • CPF0805B1K15E1 is not designed for use in humid or wet environments. It's recommended to use conformal coating or potting to protect the component from moisture and humidity. Consult TE Connectivity's application notes for guidance on environmental protection.

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CPF0805B1K15E1 Overview

Use the download button to access the CPF0805B1K15E1 schematic symbol, PCB footprint, and 3D model.
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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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