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CPF0805B470KE1 - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Height .022 INCH | Product Length 2 MM | Product Height .55 MM | Product Length .079 INCH | Product Width 1.25 MM | Product Width .049 INCH | Electrical Characteristics: Resistance Class 1kΩ – 1MΩ | Operating Voltage 100 V | Passive Component Tolerance .1 PCT | Resistance Value 470K OHM | Power Rating .1 WATT | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Element Type Thin Film | Resistor Type Precision R

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CPF0805B470KE1 - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CPF0805
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CPF0805B470KE1 - TE Connectivity  - 3D model - Resistor Chip - CPF0805
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CPF0805B470KE1 Details

  • Manufacturer Part Number:

    CPF0805B470KE1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    14

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR

  • Physical Dimension:

    2mm x 1.25mm x .5mm

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    470000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    100 V

CPF0805B470KE1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CPF0805B470KE1 is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • CPF0805B470KE1 is rated for operation up to 150°C, but it's recommended to derate the component's power rating at higher temperatures. Consult the datasheet for specific derating information. Additionally, ensure that the component is properly soldered and the PCB is designed to withstand the high temperatures.
  • Handle CPF0805B470KE1 by the edges or the body, avoiding touching the terminations or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • The recommended soldering profile for CPF0805B470KE1 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the component's specified temperature range and follows the IPC-J-STD-020 standard.
  • CPF0805B470KE1 is not hermetically sealed, so it's not recommended for use in humid or moist environments. If exposure to moisture is unavoidable, consider using a conformal coating or potting compound to protect the component. Ensure that the coating or potting material is compatible with the component's materials and doesn't compromise its performance.

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CPF0805B470KE1 Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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