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CPF0805B4R75E1 - TE Connectivity

Description: Thin Film Resistor 0805 4R75 0.1% 25PPM TE Connectivity CPF Series Precision Thin Film Surface Mount Resistor 0805 Case 4.75Ω ±0.1% 0.1W ±25ppm/°C

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CPF0805B4R75E1 - TE Connectivity - PCB symbol
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CPF0805B4R75E1 - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CPF0805
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CPF0805B4R75E1 - TE Connectivity - 3D model - Resistor Chip - CPF0805
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CPF0805B4R75E1 Details

  • Manufacturer Part Number:

    CPF0805B4R75E1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    14

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR

  • Physical Dimension:

    2mm x 1.25mm x .5mm

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    4.75 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    100 V

CPF0805B4R75E1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CPF0805B4R75E1 is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • CPF0805B4R75E1 is rated for operation up to 150°C, but it's recommended to derate the component's power rating by 1.5% per degree Celsius above 125°C. It's also important to ensure that the component is properly cooled and that the operating temperature does not exceed the maximum rated temperature.
  • CPF0805B4R75E1 is a sensitive component and requires careful handling during assembly and rework. It's recommended to use a no-clean flux and a soldering iron with a temperature of 350°C or less. Avoid using excessive force or pressure, and ensure that the component is properly aligned and seated during assembly.
  • Yes, CPF0805B4R75E1 is compatible with lead-free soldering processes. The component is designed to meet the requirements of the RoHS directive and can be soldered using lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
  • The typical tolerance for the resistance value of CPF0805B4R75E1 is ±1%. This means that the actual resistance value of the component may vary by up to 1% from the nominal value of 4.75 ohms.

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CPF0805B4R75E1 Overview

Use the download button to access the CPF0805B4R75E1 schematic symbol, PCB footprint, and 3D model.
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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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