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CPH3116-TL-E - onsemi

Description: Adoption of MBIT processes; Large current capacity; Low collector-to-emitter saturation voltage; High-speed switching; Ultrasmall package facilitates miniaturization in end products (mounting height : 0.9mm); High allowable power dissipation

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CPH3116-TL-E - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - sot-23_21
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CPH3116-TL-E - onsemi  - 3D model - SOT23 (3-Pin) - sot-23_21
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CPH3116-TL-E Details

  • Manufacturer Part Number:

    CPH3116-TL-E

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CPH3

  • Package Description:

    LEAD FREE, ULTRA SMALL, SC-59, CPH3, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318BA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    23 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    200

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    420 MHz

  • Turn-off Time-Max (toff):

    200 ns

  • Turn-on Time-Max (ton):

    35 ns

CPH3116-TL-E Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the package can help to dissipate heat efficiently. It's also recommended to use a thermal pad on the bottom of the package.
  • Ensure that the device is operated within the recommended temperature range (−40°C to +125°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider using a thermistor or thermocouple to monitor the temperature.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ensure stable operation.
  • Use a shielded enclosure, keep the layout compact, and minimize loop areas. Also, use a common-mode choke or ferrite bead on the input and output lines to reduce EMI. Ensure that the PCB layout follows good EMI design practices.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the output capacitor. The capacitor should be placed as close to the VOUT pin as possible to minimize noise and ensure stable operation.

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Manufacturer Collaborated
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CPH3116-TL-E Overview

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