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CPH3216-TL-E - onsemi

Description: Adoption of MBIT processes; Large current capacity; Low collector-to-emitter saturation voltage; High-speed switching; Ultrasmall package facilitates miniaturization in end products (mounting height : 0.9mm); High allowable power dissipation

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PCB Footprints
CPH3216-TL-E - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - CPH3
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CPH3216-TL-E - onsemi  - 3D model - SOT23 (3-Pin) - CPH3
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CPH3216-TL-E Details

  • Manufacturer Part Number:

    CPH3216-TL-E

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CPH3

  • Package Description:

    LEAD FREE, ULTRA SMALL, SC-59, CPH3, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318BA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    200

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    420 MHz

  • Turn-off Time-Max (toff):

    370 ns

  • Turn-on Time-Max (ton):

    35 ns

CPH3216-TL-E Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor junction temperature and adjust the system design accordingly.
  • Handle the device with ESD-protective equipment and follow standard ESD precautions. The device has built-in ESD protection, but it's not a substitute for proper handling and storage procedures.
  • Yes, the CPH3216-TL-E is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure you follow the recommended operating conditions and design guidelines.
  • Use a logic analyzer or oscilloscope to monitor the device's input/output signals. Check the power supply, decoupling, and PCB layout for any issues. Consult the datasheet and application notes for troubleshooting guidelines.

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CPH3216-TL-E Overview

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