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CPL-WB-00D3 - STMicroelectronics

Description: RF Directional Coupler GSM, W-CDMA, WiMax 824MHz ~ 2.17GHz 34dB 6-UFBGA, FCBGA

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PCB Footprints
CPL-WB-00D3 - STMicroelectronics PCB footprint - Other - Other - Flip Chip (6 bumps)
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3D Models
CPL-WB-00D3 - STMicroelectronics  - 3D model - Other - Flip Chip (6 bumps)
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CPL-WB-00D3 Details

  • Manufacturer Part Number:

    CPL-WB-00D3

  • Brand Name:

    STMicroelectronics

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FLIPCHIP-6

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    35 dBm

  • Insertion Loss-Max:

    0.2 dB

  • Operating Frequency-Max:

    2170 MHz

  • Operating Frequency-Min:

    824 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • RF/Microwave Device Type:

    DIRECTIONAL COUPLER

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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Sponsored

CPL-WB-00D3 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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