The recommended land pattern for CR0402-FX-1651GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-1651GLF is rated for operation up to 150°C, it's essential to consider the specific application and environmental conditions. If your design requires exposure to high temperatures, consult with Bourns Inc or a qualified engineer to ensure the component's reliability and performance.
CR0402-FX-1651GLF is a moisture-sensitive device. To prevent damage, store the components in their original packaging or a dry, nitrogen-filled environment. Follow the recommended handling and storage procedures outlined in the datasheet or consult with Bourns Inc for guidance.
The recommended soldering profile for CR0402-FX-1651GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure that your soldering process meets these specifications to prevent damage to the component.
CR0402-FX-1651GLF is not AEC-Q200 qualified. If your design requires AEC-Q200 compliance, consider using a different component that meets this standard. Consult with Bourns Inc or a qualified engineer to ensure compliance with the required specifications.
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CR0402-FX-1651GLF Overview
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