The recommended land pattern for CR0402-FX-1691GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-1691GLF is rated for operation up to 150°C, it's essential to consider the specific application's temperature profile and potential thermal stresses. Bourns recommends derating the component's power rating at higher temperatures to ensure reliability and prevent thermal runaway.
CR0402-FX-1691GLF is a moisture-sensitive device (MSD). To prevent damage, store the components in a dry environment (less than 30% RH) and follow the recommended baking and handling procedures outlined in the Bourns application note AN1301.
Bourns recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. The soldering process should be optimized to minimize thermal stress and prevent damage to the component.
While CR0402-FX-1691GLF is designed to be robust, it's essential to consider the specific application's vibration and shock requirements. Bourns recommends evaluating the component's performance under these conditions and taking necessary precautions, such as using additional mechanical support or potting, to ensure reliability.
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CR0402-FX-1691GLF Overview
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