The recommended land pattern for the CR0402-FX-1820GLF is a rectangular pad with a minimum size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
The CR0402-FX-1820GLF is rated for operation up to 150°C, but it's recommended to derate the power rating by 50% when operating above 125°C. It's also important to ensure that the PCB material and soldering process can withstand the high temperatures.
Handle the CR0402-FX-1820GLF by the edges or the body, avoiding touching the termination pads to prevent damage from electrostatic discharge (ESD). Use anti-static packaging and handling procedures to minimize the risk of ESD damage.
The CR0402-FX-1820GLF is rated for operation in environments with relative humidity up to 85% at 85°C. However, it's recommended to use a moisture-resistant coating or conformal coating to protect the device from moisture ingress in high-humidity applications.
The recommended soldering profile for the CR0402-FX-1820GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure that the soldering process is within the recommended temperature range to prevent damage to the device.
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CR0402-FX-1820GLF Overview
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