The recommended land pattern for CR0402-FX-1872GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-1872GLF is rated for operation up to 150°C, it's essential to consider the specific application's temperature profile and potential thermal stresses. Bourns recommends derating the component's power rating at higher temperatures to ensure reliability and prevent thermal runaway.
CR0402-FX-1872GLF is a moisture-sensitive device (MSD). To prevent damage, store the components in their original packaging or a dry environment (< 30% RH) below 30°C. Follow the recommended baking and handling procedures before reflow soldering to prevent moisture-related defects.
Bourns recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a ramp rate of 3°C/second. This profile ensures proper soldering and minimizes the risk of thermal damage.
While CR0402-FX-1872GLF is designed to be robust, it's essential to consider the specific application's vibration and shock requirements. Bourns recommends evaluating the component's performance under simulated environmental conditions to ensure its suitability for the intended application.
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CR0402-FX-1872GLF Overview
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