The recommended land pattern for CR0402-FX-1911GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-1911GLF is rated for operation up to 150°C, it's essential to consider the specific application's temperature profile and potential thermal stresses. Bourns recommends consulting their application notes and performing thorough thermal analysis to ensure the component's reliability in high-temperature environments.
CR0402-FX-1911GLF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry, nitrogen-filled environment, and using a moisture barrier bag or desiccant packet. Always follow the recommended MSL (Moisture Sensitivity Level) guidelines.
Bourns recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The recommended soldering process is a reflow soldering process with a ramp-up rate of 3°C/s (5.4°F/s) and a ramp-down rate of 6°C/s (10.8°F/s). Always follow the recommended soldering profile to ensure reliable assembly.
Yes, CR0402-FX-1911GLF is compatible with lead-free soldering processes. The component is designed to meet the requirements of RoHS (Restriction of Hazardous Substances) and WEEE (Waste Electrical and Electronic Equipment) directives, making it suitable for use in lead-free soldering applications.
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CR0402-FX-1911GLF Overview
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