The recommended land pattern for CR0402-FX-2263GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-2263GLF is rated for operation up to 150°C, it's essential to consider the specific application's temperature profile and potential thermal stresses. Bourns recommends derating the component's power rating at higher temperatures to ensure reliability and prevent thermal runaway.
CR0402-FX-2263GLF is a moisture-sensitive device (MSD). To prevent damage, store the components in their original packaging or in a dry, nitrogen-filled environment. Follow the recommended baking and handling procedures outlined in the IPC/JEDEC J-STD-033 standard to minimize the risk of moisture-related failures.
Bourns recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. Ensure that the soldering process is within the specified temperature range to prevent damage to the component.
While CR0402-FX-2263GLF is designed to be robust, it's essential to consider the specific application's vibration and shock requirements. Bourns recommends evaluating the component's performance under simulated environmental conditions to ensure its suitability for the intended application.
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CR0402-FX-2263GLF Overview
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