The recommended land pattern for CR0402-FX-2552GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-2552GLF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material should be suitable for high-temperature applications.
During reflow soldering, it's crucial to follow the recommended soldering profile, which typically includes a peak temperature of 260°C and a dwell time of 30-60 seconds. Ensure that the component is properly aligned and secured to prevent movement during the process.
The MSL of CR0402-FX-2552GLF is 1, which means it can withstand normal humidity levels and does not require special handling or storage. However, it's still essential to follow proper storage and handling procedures to prevent damage.
While CR0402-FX-2552GLF is a robust component, it's essential to consider the specific vibration and shock requirements of your application. Bourns recommends following the IPC-9701 standard for vibration testing and ensuring that the component is properly secured to the PCB.
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CR0402-FX-2552GLF Overview
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