The recommended land pattern for CR0402-FX-2802GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-2802GLF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material should be suitable for high-temperature applications.
CR0402-FX-2802GLF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry environment, using desiccant packaging, and baking the components before reflow soldering if they have been exposed to moisture.
The recommended soldering profile for CR0402-FX-2802GLF is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. This ensures proper soldering and minimizes the risk of component damage.
While CR0402-FX-2802GLF is a robust component, it's essential to consider the mechanical stress and vibration requirements of the application. Bourns recommends following the IPC-9701 standard for vibration testing and ensuring that the component is properly secured to the PCB to prevent mechanical stress.
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CR0402-FX-2802GLF Overview
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