The recommended land pattern for CR0402-FX-2872GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-2872GLF is rated for operation up to 150°C, it's essential to consider the specific application's temperature profile and potential thermal stresses. Bourns recommends consulting their application notes and performing thermal simulations to ensure the component's reliability in high-temperature environments.
CR0402-FX-2872GLF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry, nitrogen-filled environment, and baking them according to Bourns' recommended guidelines before reflow soldering.
Bourns recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. This profile ensures proper soldering and minimizes the risk of component damage.
While CR0402-FX-2872GLF is designed to be robust, it's essential to consider the specific application's vibration and shock requirements. Bourns recommends consulting their application notes and performing mechanical simulations to ensure the component's reliability in high-vibration or high-shock environments.
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CR0402-FX-2872GLF Overview
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