The recommended land pattern for the CR0402-FX-3161GLF is a rectangular pad with a size of 0.5 mm x 1.25 mm, with a non-solder mask defined (NSMD) pad shape.
During reflow soldering, the CR0402-FX-3161GLF should be placed on a flat, even surface to prevent tombstoning. The recommended reflow profile is 260°C peak temperature, with a ramp-up rate of 3°C/s and a dwell time of 30-60 seconds.
Yes, the CR0402-FX-3161GLF is compatible with lead-free soldering. It is designed to withstand the higher temperatures required for lead-free soldering processes.
The CR0402-FX-3161GLF has a moisture sensitivity level (MSL) of 3, which means it can withstand exposure to moisture for up to 168 hours without requiring baking or drying.
Yes, the CR0402-FX-3161GLF is designed for high-reliability applications and meets the requirements of various industry standards, including AEC-Q200 and IEC 62211.
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CR0402-FX-3161GLF Overview
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