The recommended land pattern for CR0402-FX-3163GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-3163GLF is rated for operation up to 150°C, it's essential to consider the specific application and environment. If your design requires exposure to high temperatures, consult with Bourns Inc or a qualified engineer to ensure the component's reliability and performance.
CR0402-FX-3163GLF is a moisture-sensitive device (MSD). To prevent damage, store the components in their original packaging or in a dry, nitrogen-filled environment. Follow the recommended handling and storage procedures outlined in the datasheet or by Bourns Inc.
The recommended soldering profile for CR0402-FX-3163GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure that the soldering process is within the specified temperature range to prevent damage to the component.
CR0402-FX-3163GLF is not AEC-Q200 qualified. If your design requires AEC-Q200 compliance, consider using a different component that meets the necessary automotive standards.
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CR0402-FX-3163GLF Overview
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