The recommended land pattern for CR0402-FX-3572GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-3572GLF is rated for operation up to 150°C, it's essential to consider the specific application's temperature profile and potential thermal stresses. Bourns recommends derating the component's power rating at higher temperatures to ensure reliability and prevent thermal runaway.
CR0402-FX-3572GLF is a moisture-sensitive device (MSD). To prevent damage, store the components in a dry environment (less than 30% RH) and follow the recommended baking and handling procedures outlined in the Bourns application note AN1301.
Bourns recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. Avoid using excessive soldering temperatures or times, as this can cause damage to the component or the PCB.
While CR0402-FX-3572GLF is designed to be robust, it's essential to consider the specific application's vibration and shock requirements. Bourns recommends evaluating the component's performance under simulated environmental conditions to ensure reliability and durability.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
CR0402-FX-3572GLF Overview
Use the download button to access the CR0402-FX-3572GLF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CR040,
or try a keyword search, such as Ruthenium Oxide Resistors
