The recommended land pattern for CR0402-FX-3573GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-3573GLF is rated for operation up to 150°C, it's essential to consider the specific application's temperature profile and potential thermal stresses. Bourns recommends derating the component's power rating at higher temperatures to ensure reliability and prevent thermal runaway.
CR0402-FX-3573GLF is a moisture-sensitive device (MSD). To prevent damage, store the components in their original packaging or a dry, nitrogen-filled environment. Follow the recommended baking and handling procedures outlined in the IPC/JEDEC J-STD-033 standard to minimize the risk of moisture-related failures.
Bourns recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. Ensure the soldering process is within the specified temperature range to prevent thermal damage and ensure reliable joints.
While CR0402-FX-3573GLF is designed to be reliable, it's essential to consider the specific environmental conditions of your application. Bourns recommends evaluating the component's performance under simulated vibration and environmental stress testing to ensure its suitability for your specific use case.
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CR0402-FX-3573GLF Overview
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