The recommended land pattern for the CR0402-FX-4021GLF can be found in the Bourns application note AN204, which provides guidelines for PCB layout and land pattern design.
During reflow soldering, the CR0402-FX-4021GLF should be exposed to a peak temperature of 260°C for no more than 20-30 seconds. It's also recommended to use a nitrogen atmosphere to minimize oxidation.
The CR0402-FX-4021GLF has an MSL rating of 3, which means it can be exposed to a relative humidity of 60% at 30°C for up to 168 hours without being damaged.
Yes, the CR0402-FX-4021GLF is designed for high-reliability applications and meets the requirements of various industry standards, including AEC-Q200 and MIL-PRF-83446.
The CR0402-FX-4021GLF should be stored in its original packaging, away from direct sunlight and moisture, at a temperature range of -20°C to 40°C and relative humidity below 60%.
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CR0402-FX-4021GLF Overview
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