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CR0402-FX-5103GLF - Bourns

Description: CR0402 CHIP RESISTOR

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CR0402-FX-5103GLF - Bourns - PCB symbol
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CR0402-FX-5103GLF - Bourns PCB footprint - Resistor Chip - Resistor Chip - CR0402
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CR0402-FX-5103GLF - Bourns - 3D model - Resistor Chip - CR0402
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CR0402-FX-5103GLF Details

  • Manufacturer Part Number:

    CR0402-FX-5103GLF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.32 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PLASTIC, 7 INCH

  • Rated Power Dissipation (P):

    0.0625 W

  • Rated Temperature:

    70 °C

  • Resistance:

    510000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

CR0402-FX-5103GLF Frequently Asked Questions (FAQs)

  • The recommended land pattern for CR0402-FX-5103GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While CR0402-FX-5103GLF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the component's reliability and lifespan may be affected by prolonged exposure to high temperatures.
  • CR0402-FX-5103GLF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry, nitrogen-filled environment, and baking them according to the manufacturer's recommendations before reflow soldering.
  • The recommended reflow soldering profile for CR0402-FX-5103GLF is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. It's essential to follow the manufacturer's recommended reflow profile to ensure proper soldering and minimize the risk of component damage.
  • While CR0402-FX-5103GLF is designed to be a reliable component, it's essential to consider the component's mechanical stress limits and ensure that it is properly secured to the PCB to prevent damage or detachment due to vibration or shock.

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CR0402-FX-5103GLF Overview

Use the download button to access the CR0402-FX-5103GLF schematic symbol, PCB footprint, and 3D model.
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