The recommended land pattern for CR0402-FX-6810GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-6810GLF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material selection should be suitable for high-temperature applications.
CR0402-FX-6810GLF is a moisture-sensitive device. To prevent damage, it's crucial to store the components in a dry environment (less than 30% RH) and follow the recommended baking and soldering procedures to minimize moisture absorption.
The recommended soldering profile for CR0402-FX-6810GLF is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow the recommended soldering profile to prevent damage to the component.
While CR0402-FX-6810GLF is designed to be robust, it's essential to consider the component's mechanical stress limits and ensure that the PCB design and assembly can withstand the expected vibration and shock levels.
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CR0402-FX-6810GLF Overview
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