The recommended land pattern for CR0402-FX-6813GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-6813GLF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, high-temperature applications may require special soldering processes and materials.
CR0402-FX-6813GLF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry environment, using desiccant packaging, and baking the components before reflow soldering.
The recommended soldering process for CR0402-FX-6813GLF is reflow soldering with a peak temperature of 260°C (500°F) for 10-30 seconds. It's essential to follow the recommended soldering profile and ensure that the component is properly aligned during the soldering process.
While CR0402-FX-6813GLF is designed to be robust, it's essential to consider the component's mechanical stress limits and ensure that it is properly secured to the PCB. Additional mechanical support or potting may be required for high-vibration or high-shock applications.
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CR0402-FX-6813GLF Overview
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