The recommended land pattern for CR0402-FX-7321GLF is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0402-FX-7321GLF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material should be suitable for high-temperature applications.
During reflow soldering, it's crucial to follow the recommended soldering profile, which typically includes a peak temperature of 260°C and a dwell time of 20-30 seconds. Ensure that the component is properly aligned and secured to prevent movement during the process.
The MSL of CR0402-FX-7321GLF is MSL 1, which means it can withstand a maximum of 30 days at 30°C and 60% relative humidity before soldering. Proper storage and handling procedures should be followed to prevent moisture absorption.
While CR0402-FX-7321GLF is designed to be robust, it's essential to consider the specific vibration and shock requirements of your application. Bourns recommends following the IPC-9701 standard for vibration testing and ensuring that the component is properly secured to the PCB.
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CR0402-FX-7321GLF Overview
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