The recommended land pattern for the CR0402-FX-7870GLF is a rectangular pad with a minimum size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
The CR0402-FX-7870GLF is rated for operation up to 150°C, but it's recommended to derate the power rating by 50% when operating above 125°C. Additionally, ensure that the PCB material and soldering process can withstand the high temperatures.
Handle the CR0402-FX-7870GLF by the edges to prevent damage to the resistive element. Avoid touching the component's surface, as the oils from human skin can affect solderability. Use anti-static wrist straps and mats to prevent electrostatic discharge (ESD) damage.
The CR0402-FX-7870GLF has an MSL rating of 1, which means it can withstand normal humidity levels and does not require special handling or storage procedures.
The CR0402-FX-7870GLF is designed to withstand normal vibration and shock levels, but it's recommended to ensure that the PCB is properly secured and the component is properly soldered to prevent mechanical stress. Consult Bourns' application notes for more information.
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CR0402-FX-7870GLF Overview
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