The recommended land pattern for CR0603-FX-2671ELF is a rectangular pad with a size of 0.75 mm x 0.75 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0603-FX-2671ELF is rated for operation up to 150°C, it's essential to consider the specific application's temperature profile and the component's power rating. If the application exceeds the component's power rating or operates at temperatures above 150°C, it's recommended to consult with Bourns Inc or consider alternative components.
CR0603-FX-2671ELF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry, nitrogen-filled environment, and baking them according to Bourns Inc's recommended guidelines before reflow soldering.
Bourns Inc recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a ramp rate of 3°C/second. However, it's essential to consult the specific datasheet and application notes for the most up-to-date and detailed reflow soldering guidelines.
While CR0603-FX-2671ELF is designed to operate in a variety of environments, it's not recommended for applications with high humidity or exposure to water. If the application requires operation in such conditions, it's essential to consider alternative components with enhanced environmental protection, such as conformal coating or hermetic sealing.
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CR0603-FX-2671ELF Overview
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