The recommended land pattern for CR0603-FX-4994ELF is a rectangular pad with a size of 0.75 mm x 0.75 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While CR0603-FX-4994ELF is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component doesn't exceed its maximum operating temperature. Additionally, high-temperature soldering profiles should be used during assembly.
CR0603-FX-4994ELF is a moisture-sensitive device (MSD). To prevent damage, it's crucial to follow proper handling and storage procedures, such as storing the components in a dry environment (< 30% RH) and using a dry pack or desiccant when storing for extended periods.
Bourns recommends using a reflow soldering process with a peak temperature of 260°C ± 5°C, and a dwell time of 20-30 seconds above 220°C. Hand soldering is not recommended due to the risk of overheating the component.
Bourns recommends using a PCB material with a high thermal conductivity, such as FR4 or equivalent, to ensure proper heat dissipation. The PCB material should also be compatible with the recommended soldering process.
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CR0603-FX-4994ELF Overview
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