The recommended land pattern for the CR0805-FX-6490ELF is a rectangular pad with a size of 0.8 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2 mm from the component body.
During reflow soldering, the CR0805-FX-6490ELF should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature, with a ramp rate of 3°C/s and a dwell time of 30-60 seconds.
Yes, the CR0805-FX-6490ELF is compatible with lead-free soldering. The component is RoHS-compliant and can withstand the higher temperatures required for lead-free soldering. However, it's recommended to follow the manufacturer's recommended reflow profile and soldering guidelines to ensure reliable assembly.
The maximum operating temperature range for the CR0805-FX-6490ELF is -40°C to +125°C. However, the component's performance and reliability may degrade at extreme temperatures. It's recommended to consult the datasheet and application notes for specific temperature-related guidelines.
The CR0805-FX-6490ELF is designed for general-purpose applications and may not be suitable for high-vibration or high-shock environments. However, Bourns Inc offers other products with enhanced mechanical robustness, such as the CR0805-FX-6490ELF-V, which is designed for high-reliability applications. Consult the datasheet and application notes for specific guidance.
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CR0805-FX-6490ELF Overview
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