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CR2010-FX-20R0ELF - Bourns

Description: Thick Film Resistors - SMD 20OHM 1/2WATT 1%

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CR2010-FX-20R0ELF - Bourns PCB footprint - Resistor Chip - Resistor Chip - CR2010-FX-20R0ELF
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CR2010-FX-20R0ELF Details

  • Manufacturer Part Number:

    CR2010-FX-20R0ELF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    11

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Resistance:

    20 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2010

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

CR2010-FX-20R0ELF Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, minimize parasitic inductance, and reduce electromagnetic interference (EMI).
  • The CR2010-FX-20R0ELF has a maximum operating temperature of 125°C. To ensure reliable operation, it's crucial to provide adequate thermal management, such as using thermal vias, heat sinks, or thermal interface materials. Additionally, ensure good airflow and avoid blocking airflow around the component.
  • Bourns recommends following the JEDEC J-STD-020D.1 standard for soldering profiles. The component is compatible with lead-free soldering processes, and it's essential to follow the recommended temperature and time profiles to prevent damage or degradation.
  • To ensure reliability and longevity, it's essential to follow proper storage and handling procedures, avoid exposure to moisture and contaminants, and use conformal coatings or potting compounds to protect the component from environmental stresses.
  • The CR2010-FX-20R0ELF has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures. Additionally, the component is designed to prevent latch-up conditions, but it's crucial to follow proper power sequencing and voltage ramp-up procedures to prevent latch-up.

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CR2010-FX-20R0ELF Overview

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Part Image RC10K200FBG Fenghua (HK) Electronics Ltd

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Part Image RC10K20R0FTG Fenghua (HK) Electronics Ltd

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Part Image RC10K20R0FC Fenghua (HK) Electronics Ltd

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For a full list of alternate parts for CR2010-FX-20R0ELF, check out Findchips.com