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CRG2512J470R - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Height .022 INCH | Product Width .126 INCH | Product Height .55 MM | Product Width 3.2 MM | Product Length 6.35 MM | Product Length .25 INCH | Electrical Characteristics: Operating Voltage 200 V | Resistance Value 470 OHM | Passive Component Tolerance 5 PCT | Resistance Class Up to 1kΩ | Power Rating 1 WATT | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Element Type Thick Film | Package Size Code 2512 | Resi

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CRG2512J470R - TE Connectivity - PCB symbol
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PCB Footprints
CRG2512J470R - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CRG2512
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3D Models
CRG2512J470R - TE Connectivity - 3D model - Resistor Chip - CRG2512
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CRG2512J470R Details

  • Manufacturer Part Number:

    CRG2512J470R

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    CHIP, ROHS COMPLIANT

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    11 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • Additional Feature:

    LASER TRIMMABLE

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Packing Method:

    TR

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    470 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

CRG2512J470R Frequently Asked Questions (FAQs)

  • The recommended land pattern for CRG2512J470R is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, CRG2512J470R is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's electrical characteristics may degrade at elevated temperatures, so it's essential to consult the datasheet and perform thermal analysis to ensure reliable operation.
  • To prevent damage, handle CRG2512J470R by the edges or the body, avoiding touching the terminations or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • CRG2512J470R is not hermetically sealed, so it's not recommended for use in humid or moist environments. However, the component is designed to meet the requirements of IPC/JEDEC J-STD-020, which includes moisture sensitivity level (MSL) 1, indicating it can withstand some exposure to moisture. If you need to use the component in a humid environment, consider applying a conformal coating or potting compound to protect it.
  • The recommended soldering profile for CRG2512J470R is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a ramp rate of 3°C/second. It's essential to follow the soldering profile recommended by TE Connectivity to ensure reliable solder joints and prevent damage to the component.

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CRG2512J470R Overview

Use the download button to access the CRG2512J470R schematic symbol, PCB footprint, and 3D model.
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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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