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CRGS1206J680R - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Length 3.1 MM | Product Length .122 INCH | Product Width .061 INCH | Product Width 1.55 MM | Product Height .022 INCH | Product Height .55 MM | Electrical Characteristics: Resistance Class Up to 1kΩ | Resistance Value 680 OHM | Operating Voltage 200 V | Passive Component Tolerance 5 PCT | Power Rating .6 WATT | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Resistor Type General Purpose Resistor | Package Size

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Symbol
CRGS1206J680R - TE Connectivity - PCB symbol
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PCB Footprints
CRGS1206J680R - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CRGS1206
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3D Models
CRGS1206J680R - TE Connectivity - 3D model - Resistor Chip - CRGS1206
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CRGS1206J680R Details

  • Manufacturer Part Number:

    CRGS1206J680R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    11

  • Construction:

    RECTANGULAR PACKAGE

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.55 mm

  • Packing Method:

    TR

  • Physical Dimension:

    3.1mm x 1.55mm x .55mm

  • Rated Power Dissipation (P):

    0.6 W

  • Rated Temperature:

    70 °C

  • Resistance:

    680 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    400 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

CRGS1206J680R Frequently Asked Questions (FAQs)

  • The recommended land pattern for CRGS1206J680R is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, CRGS1206J680R is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated for temperature and power handling to prevent overheating and premature failure.
  • During assembly and rework, it's essential to handle CRGS1206J680R with care to prevent damage. Use anti-static wrist straps, mats, or tables to prevent electrostatic discharge (ESD). Avoid touching the component's leads or body, and use a vacuum pickup or tweezers to handle the component. For rework, use a low-temperature soldering iron and a solder with a melting point below 260°C.
  • Yes, CRGS1206J680R is compatible with lead-free soldering processes. The component is designed to meet the requirements of RoHS (Restriction of Hazardous Substances) and is suitable for use with lead-free solders such as SAC305 or Sn96.5Ag3Cu0.5.
  • The typical tolerance for the resistance value of CRGS1206J680R is ±1%. This means that the actual resistance value may vary by up to 1% from the nominal value of 680 ohms.

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CRGS1206J680R Overview

Use the download button to access the CRGS1206J680R schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CRGS1, or try a keyword search, such as Fixed Resistors

About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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