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CRGS2512J10K - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Length 6.35 MM | Product Height .022 INCH | Product Height .55 MM | Product Width 3.2 MM | Product Width .126 INCH | Product Length .25 INCH | Electrical Characteristics: Resistance Class 1kΩ – 1MΩ | Power Rating 1.5 WATT | Passive Component Tolerance 5 PCT | Resistance Value 10K OHM | Operating Voltage 250 V | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Element Type Thick Film | Package Size Code 2512 |

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CRGS2512J10K - TE Connectivity - PCB symbol
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PCB Footprints
CRGS2512J10K - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - CRGS2512
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3D Models
CRGS2512J10K - TE Connectivity - 3D model - Resistor Chip - CRGS2512
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CRGS2512J10K Details

  • Manufacturer Part Number:

    CRGS2512J10K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    10

  • Construction:

    RECTANGULAR PACKAGE

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    6.35 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR

  • Physical Dimension:

    6.35mm x 3.2mm x .55mm

  • Rated Power Dissipation (P):

    1.5 W

  • Rated Temperature:

    70 °C

  • Resistance:

    10000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    250 V

CRGS2512J10K Frequently Asked Questions (FAQs)

  • The recommended land pattern for CRGS2512J10K is a rectangular pad with a size of 1.3 mm x 1.3 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While CRGS2512J10K has a rated operating temperature range of -55°C to 125°C, it's essential to consider the derating curve for high-temperature applications. TE Connectivity recommends derating the component by 1.25% per °C above 85°C to ensure reliable operation.
  • CRGS2512J10K is a moisture-sensitive device (MSD) with a moisture sensitivity level (MSL) of 3. To prevent damage, store the components in a dry environment (less than 30% relative humidity) and follow the recommended baking procedure before reflow soldering.
  • TE Connectivity recommends a reflow soldering profile with a peak temperature of 260°C ± 5°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second maximum. This ensures proper soldering and minimizes the risk of component damage.
  • While CRGS2512J10K is designed to withstand normal PCB assembly and handling, it's not recommended for applications with high mechanical stress, such as extreme vibration, bending, or torsion. If your application requires high mechanical robustness, consider alternative components or consult with TE Connectivity's technical support.

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CRGS2512J10K Overview

Use the download button to access the CRGS2512J10K schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CRGS2, or try a keyword search, such as Fixed Resistors

About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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