CRM0805-FX-1002ELF - Bourns

CRM0805-FX-1002ELF Frequently Asked Questions (FAQs)

• What is the recommended land pattern for this component?
  The recommended land pattern for the CRM0805-FX-1002ELF is a rectangular pad with a size of 0.8mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
• How do I handle the component's thermal considerations during PCB design?
  The CRM0805-FX-1002ELF has a thermal resistance of 250°C/W. To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB with a size of at least 2mm x 2mm, and to use a thermal via array to dissipate heat to the opposite side of the board.
• What is the component's moisture sensitivity level (MSL) rating?
  The CRM0805-FX-1002ELF has an MSL rating of 1, which means it can withstand a maximum of 30 days in a humidity-controlled environment (less than 60% RH) without requiring baking or drying before reflow soldering.
• Can I use this component in a high-vibration or high-shock environment?
  The CRM0805-FX-1002ELF is designed for general-purpose use and may not be suitable for high-vibration or high-shock environments. If your application requires high reliability in harsh environments, consider using a component with specific vibration or shock ratings, such as those designed for automotive or aerospace applications.
• How do I ensure the component's reliability in high-temperature applications?
  The CRM0805-FX-1002ELF has a maximum operating temperature of 150°C. To ensure reliability in high-temperature applications, consider using a component with a higher temperature rating, and ensure that the PCB design and materials can withstand the operating temperature range.